Match the substrate
Supply the composition and coating of the material. Confirm suitability and extraction before processing a new substrate.
Laser Marking
A dedicated desktop marking process for compatible non-metals.
A 10.6 μm CO2 RF marking platform with a matched field lens, beam expander and combiner. This is a desktop marking system, not a large-bed CO2 cutting machine; select the source and optics for the required surface result.
Equipment platform

Representative desktop platform shown. Laser source, optics, cooling and accessories vary by configuration.
Applications & configuration
Tell us the material composition, surface finish, part dimensions, artwork, marking size and production quantity. Cutting thickness is not inferred from marking-source power.
Supply the composition and coating of the material. Confirm suitability and extraction before processing a new substrate.
The lens, beam expander and combiner work together. Alternative marking fields require a matched optical configuration.
D35L and D35 are source model names, not confirmed wattages. The exact rating and cooling are specified with your quotation.
Machine specifications
| Desktop CO2 Laser Marking Machine — technical specifications | |
|---|---|
| Wavelength | 10.6 μm |
| Max. marking speed | ≤ 7,000 mm/s |
| Minimum line width | 0.03 mm |
| Repetition rate | ≤ 25 kHz (confirm selected source) |
| Machine size | 600 × 400 × 760 mm |
| Packing size | 770 × 490 × 920 mm |
| Net / gross weight | Approx. 40 / 50 kg |
| Packaging | PE foam + wooden case |
Application-based quotation
Tell us the material composition, surface finish, part dimensions, artwork, marking size and production quantity. Cutting thickness is not inferred from marking-source power.